According to an embodiment disclosed herein, a microelectronic device to be encapsulated is built on, or alternatively in, a substrate. It is preferable that the first electrolyte layer is formed thinner than the second electrolyte layer. At least a portion of one or more prongs may be positioned between the fins of a heat sink. The mobile work platform is controllable at distances up to five miles in an environment including buildings or other obstructions and up to twenty miles with a clean line of sight.