The present invention provides a contact probe pin having both electrical conductivity and durability and being capable of realizing low adhesion to the device under test and thereby stably maintaining electrical contact over a long period of time. A web server processes product personalization information for a vendor. , interconnect metallization in semiconductor device structures, as an adhesive seed layer for plating, for the deposition of a thin-film recording head or for circuitization of packaging components. Consequently, the command sequence can be restarted from the middle.