A semiconductor device which comprises an SOI substrate having an insulating layer between a semiconductor substrate layer and a semiconductor layer in a surface of which a semiconductor element is formed, and at least one external terminal provided, via an insulating film, on a surface of the semiconductor substrate layer and electrically connected to the semiconductor element. The array is produced on a device chip that is to be attached to a carrier, or to a carrier along with other devices, some of which may be selected to have similar interconnect structures so as to form all together an assembled carrier that functions as a complete computing, communications or networking system. The closed tubular casing has a sheath formed by substantially inextensible intertwined wires. A cam mechanism is provided in the throat and is movable from a disengaged position to an engaged position responsive to insertion into the throat of articles above a predetermined maximum thickness threshold. Ink limiting is performed gradually as the system approaches the ink limit, avoiding sudden changes in the slope of the system response characteristics.