A high melting point soldering layer includes a low melting point metal layer, a first high melting point metal layer disposed on a surface of the low melting point metal layer, and a second high melting point metal layer disposed at a back side of the low melting point metal layer. The packaging container can be set alone on a support surface and the contents, such as confectionery, of the packaging container can be taken out without holding the packaging container by hand. Handover of the communication device is allowed after determining that the release of the bearer has been completed.