A computer-implemented method for organizing data in a two-topology configuration is disclosed. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized andor nanosized semiconductor structures onto substrates, including large area substrates andor flexible substrates. The second blocks are arranged in a base configuration to form the first block, and include a plurality of sub-faces having a first set of image segments defined thereon. The kit further includes a cartridge for packaging said implant in the introduction configuration. The virtual switch receives a first packet associated with the second HA. A first metal material, exposed in the surface of the electrode pad 16 opposite to an insulating resin layer 12 and constituting the electrode pad 16, has higher free energy for forming an oxide than a second metal material exposed in the surface of the interconnect 14 opposite to the insulating resin layer 12 and constituting the interconnect 14.