In a method and device for pickling a rolled metal, in particular, steel strip, the metal strip is fed to a regulated pickling process. Within the region of examination, the RF magnetic field has a spatially varying intensity. The hinge further includes a pair of hinge lugs each having a first set of surfaces defining openings through which a second hinge pin passes and at least one of the pair of hinge lugs having a surface defining an opening through which a locking pin reversibly travels. The code may be digital binary or may be other numerical bases. The grain boundaries enable grain boundary sliding for mitigation of stress during thermal cycling of the semiconductor chip and the package on the C4 ball.