A semiconductor device includes a semiconductor element mounted on a substrate; at least one electronic part arranged around the semiconductor element; and a heat radiation member bonded to a backside of the semiconductor element by a bonding material. The device also includes a hole transport layer disposed over the hole injecting layer; a light-emitting layer doped with a blue light-emitting compound, disposed directly on the hole transport layer; and an electron transport layer disposed over the blue light-emitting layer. The notch section may be configured to radially extend to at least the center point.