An under bond pad structure is described for integrated circuit dice are that have active circuits located below at least some of the bond pads. The compositions can include a carrier oil such as silicon oil, soy methyl ester, or a vegetable oil, and can be in the form of an emulsion. A structure including a support defining a opening having a minimum opening dimension, and a compressively stressed thin-film membrane disposed to occlude the opening, the membrane contacting at least a portion of the support. The number of retransmissions and the retransmission priority can be varied according to characteristics of the transmitted data, so that retransmissions is suitable for the characteristics of the data and to more stably receive the data that is more influential to the restoration of the data.