A semiconductor package includes a semiconductor die with a plurality of solder bumps formed on bump pads. The process integrates a pulse combustor steam reformer with a gas turbine to generate electricity such that efficiency is higher than those of conventional and current advanced power systems, emissions are lower than those proposed in the new environmental regulations, and performance is comparable to that of combined cycle, even though a bottoming cycle is not included here. The assembled power element is placed in a vacuum container, and a small hole formed in the upper housing is subjected to spot welding in the vacuum atmosphere, whereby the small hole is sealed by a weld metal. A plurality of corner cleats, which have a mating hook and loop fastener material secured to the bottom thereof, are provided and can be removably attached on the material which is secured to the base to cradle and resiliently support corners of the electronic equipment. The compressor oil is conducted to an oil inlet of the gearbox and is circulated through the gearbox to an oil outlet of the gearbox which communicates with an air inlet of the compressor. The transgenic monocot plants include maize, wheat, rice and barley.