A telecommunication system in which a plurality of terminals communicate with a base station or a connection station and a management unit determines the allocation of resources for calls from each terminal to the connection station. The root cause for the warpage and stress of a semiconductor chip package under a temperature change is the CTE mismatch between the chip and substrate. The latch signal is used to turn onoff a switch. A suggestion may be surfaced in a user interface that identifies at least a portion of the one other documents. The plating layer is formed on the first gate portions and the second gate portions, and exposes the runner portions, so as to save the plating material.