The present invention relates to a nickel alloy sputtering target comprising 1 to 30 at % of Cu; 2 to 25 at % of at least one element selected from among V, Cr, Al, Si, Ti and Mo; remnant Ni and unavoidable impurities so as to inhibit the Sn diffusion between a solder bump and a substrate layer or a pad. A simple but powerful image stack is employed in creating an enhanced image from a stack of registered images. The window covering fabric thus formed can be installed in an overlapped fashion in a front side and a back side relative to each other to become a double-layer zebra-stripe shade and is movable through a transverse-moving means to make the light penetrating portions and the opaque portions overlapped or staggered with each other to facilitate adjustment of indoor lighting or dark condition. A subcommand for accessing the partial storage area subjected to the division is replaced with the generated subcommands. The combinational logic circuit is in communication with the first and second banks of memory tables and the second source register, receives the lookup results, and processes the lookup results and the second data item in the second source register to produce a result data item. Accordingly, the ease of selecting an optimize option for an XPS file is increased.