A method for manufacturing a semiconductor device from a semiconductor wafer having a first major surface, a recess provided inside a periphery on opposite side of the first major surface and surrounded by the periphery, and a second major surface provided at bottom of the recess is provided. In one embodiment, the present invention relates to the production of a 2,2,4,4-tetraalkylcyclobutane-1,3-diol by hydrogenation of a 2,2,4,4-tetraalkylcyclobutane-1,3-dione in the presence of an iridium-promoted cobalt-based catalyst. The rear end of the frame is fitted with a coupling piece which is pivotably connected to the base while the front end thereof includes a movable supporting bar which is attached to a resilient member at the bottom end thereof. The MMMIC device is enabled to communicate with the close proximity communication device at one of the distance of greater than the CPC detection perimeter and less than the CPC detection perimeter based on the type of device that is identified.