Embodiments of the invention generally relate to a method for etching in a processing platform wherein robust pre-etch and post-etch data may be obtained in-situ. The compounds can include a liquid ethylene propylene diene or a liquid ethylene propylene mixed with a filler system, a plasticizer, and a cross-linking agent to form the compound. A terminal external to the semiconductor device package may be electronically coupled to the logic device and the integrated circuit.