A micro chip-scale-package system including providing a metal pattern on an adhesion material, attaching an integrated circuit die to the metal pattern, and molding an encapsulant over the integrated circuit die and the metal pattern. In this process a screen printing screen is used that comprises two superimposed fabrics, the fabric intended to be placed opposite the face to be screen printed having a smaller mesh opening than the other fabric, the difference in mesh opening between the two fabrics lying in the range from 22 to 65 \u03bcm. The electronic album file is managed in the image server 30, and is transmitted to the client computer 1 which issues a request to view the electronic album. , mapping, registry functions or registry equivalent functions across multiple operating systems. From the point of contact P, the paper web W will be carried by the flexible belt 6 to the reel-spool 5.