A megasonic cleaning apparatus is provided for removing contamination particles on a wafer. A print data generated by a design application is appended with data indicating a cutting mode appropriate to the print data and transmitted to a printer. The feedforward signal is derived from the setpoint signal. The retainer assembly functions with the compass card assembly to retain magnets. The guiding funnel retains the product in the active region of the device and the feed screw generates an increased material pressure in the center. A rail is formed along each side edge of the rigid part by bending the side edge in a thickness direction of the rigid part.