A power semiconductor package is disclosed with high inductance rating while exhibiting a reduced foot print. The wafer-on-wafer package can be burned-in and tested at the wafer level prior to segmenting, or singulating, the wafer-on-wafer package into a plurality of individual chip-scale packages. The method further includes, based upon the application data, accessing one or more of the first mobile device, a second mobile device and a content provider website to obtain at least some of the lost data. For better processing of pieces of fruit or vegetables with a high juice content, the interstitial cutting teeth are preferably higher than the other cutting teeth of the grating disk. The capacitor has an upper electrode which may be a conventional electrode or which may have a multilayer structure similar to that of the lower electrode.