A variably controlled LCD backlight is disclosed. In the wafer level chip size package, with such an n-shape junction instead of a conventional T-shape junction observed in Shellcase type wafer level chip size package technology, electrical connections between compatible pads and external leads are more reliable due to larger connection area than the counterpart in the T-shape junction. The SC feedback circuit is coupled between the differential inputs and the differential outputs of the amplifier to selectively control a feedback of the amplifier. A level two agent processing module handles the telephone call when the level three agent is not available. In a case where the encoding rate 13<R\u226623, one bit is set. Next, the method includes generating one or more reports having the charging status for each electric vehicle.