Removes undesirable camera rotation from a panoramic video. Dependencies of polish rate and substrate thickness on process parameters of downforce and polish speed, and on the characteristic product high feature area on the wafer, are explicitly defined and used to control Chemical-Mechanical Polish in Run-to-Run and real-time semiconductor production control applications. A number of inputoutput ports are provided to couple signals to and from the ASIC. The randomized apertures may be provided in the aperture mask by providing a diffusive layer between the aperture mask and the substrate, and directing coherent radiation through the lens array, the diffusive layer and aperture mask. The present invention further relates to a method for the production of such a nanoparticulate composition. The PLL includes a voltage controlled oscillator which is capable of generating multiple phase shifted output signals, and multiple phase detectors capable of determining the phase differences between the output signals and a reference clock.