A heat-dissipating circuit board assembly is composed of a heat-conducting base board and a circuit board. The characteristic feature is the presence of a gas regulating arrangement comprising a) a gradually adjustable function, e. One or more thin film interconnect layers are then created on top of the dielectric layer. The distal and proximal tube sections are rotationally fixed to each other when the fixing members of the second connector portion are engaged with the fixing members of the first connector portion.