1461048776-6a62209c-94e5-467d-ac6f-ae561cb31fd8

An integrated circuit having an indirect sensor and a direct sensor formed on a common semiconductor substrate is disclosed. The method includes monitoring runtime dependencies invoked during execution of a service transaction associated with the remote service, the service transaction being requested by a service requester. The mat is formed of primarily heat moldable, silica based glass fibers containing Al2O3 and is molded at a selected temperature and for a selected time duration to heat set the fibers, whereby the frustum-shaped mat is seamless and self-supporting, requiring no shape no shape retaining elements or chemical binders. The two sets of data are combined to provide a comprehensive seismic survey image without requiring conventional seismic source volume.