A method for securing two or more semiconductor device components to one another is provided. In one embodiment, the auction data is obtained from an on-line auction which is characterized by bidders not necessarily knowing the start time of the auction. The connecting part defines at least one passageway for passing the ligature in such a manner that two distinct strands of the ligature can be engaged in the passageway so that the two strands of the ligature define a first ligature portion forming a loop extending from one side of the connecting part, and second and third ligature portions extending from the other side of the connecting part.