Provided are a solder bump, a method of manufacturing the same, and a method of bonding a light emitting device using the method of manufacturing the solder bump. The invention relates to seeds of soybean cultivar 0332126, to the plants of soybean 0332126 and to methods for producing a soybean plant produced by crossing the cultivar 0332126 with itself or another soybean variety. The reliability buffer is provided having a time duration value and an activity time precedence relationship, including a lead or lag value, with at least one upstream activity.