There is provided a tire ground contact pattern specifying method and an apparatus thereof for specifying a tire ground contact pattern usable to perform the stable control of a running vehicle. A first zone defined between the first fold guiding lines is tucked inwardly of the article along the first fold guiding lines and a second zone defined between the second fold guiding lines is tucked inwardly of the article along the second fold guiding lines. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface.