A semiconductor device that may include at least one temperature sensing circuit is disclosed. Part of the perimeter of the movable partition may include a lip that is preferably configured and formed of suitable materials so as to permit for the containment of fine powders, liquids, etc. The absorbent material is saturated with a thermoset resin and pulled into the existing conduit. The distal washer member communicates with a first surface of the inner member and the proximate washer member communicates with a second surface of the inner member. Further, the carrier apparatus loads the wafer held in a non-contact manner from above by the chuck member on the fine movement stage. When the handheld computing unit is in a extended mode: the hardware section is operably coupled to a hardware section of an extended computing unit; the operating system section is operably coupled to an operating system section of the extended computing unit; and the application section is operably coupled to an application section of the extended computing unit.