Methods and apparatus are provided for controlling a steering assist unit of a vehicle. More specifically, a methodology to breakdown the insulating layer on wafer backside is provided to significantly reduce the damage on the wafer backside while proceeding with the grounding process. The computed locality measure is compared to an at least partly dynamically determined fragmentation repair criteria, and a repair decision is made based at least in part on the comparison. This tool comprises means for exerting pressure on a first electrical component attached to a first side of the printed circuit card, in order to mount or remove a second electrical component on the opposite side of the printed circuit card.