Packaging structures and methods for semiconductor devices are disclosed. A blower is operably connected to the ram air fan and is configured to redirect a cooling flow across the ram air fan motor from a substantially axially directed flow to a substantially radially directed flow thereby increasing the cooling flow across the ram air fan motor. When the tension difference is non-linear relative to the speed of the driver or the slope of the relationship is substantially less than an expected slope, then slipping is determined to be present. A strainer is between the bottom end of the upper chamber and the top end of the lower chamber.