A semiconductor device includes a first die pad, a first semiconductor chip provided on the first die pad, a second die pad, a second semiconductor chip provided on the second die pad, and a sealing resin made of a first resin material, sealing the first die pad, the first semiconductor chip, the second die pad and the second semiconductor chip. The carton includes a top panel, a bottom panel, at least one side panel extending between the top panel and the bottom panel and a movable section that is movable between a first position and a second position. Other embodiments may be described andor claimed. It is possible to embody the decoupling capacitor of a single stage cell type by connecting the conductive layer to a top interconnection layer. A double layer of skin 14, 15 is pulled up from the penile shaft and laid against this inner member, FIG.