A method, system, and apparatus for improved IC device packaging is described. The peak detection unit is configured to determine at least one peak parameter of a peak in a Fourier transformed reflection spectrum of infrared radiation reflected off a sample that may comprise trench structures. According to another embodiment, the electronic VIN request is generated at an entity, such as a remote call center, that is remotely located from the vehicle. The interrupt wire is coupled between one component-mounted wire and the common wire, and is configured to melt in accordance with heat generated by an overcurrent to interrupt a coupling between the component-mounted wire and the common wire. Boundary impulses are generated according to changes in intensity of the light reflected back by the color filter. The second tee is a specially configured tapping tee specifically adapted for bleeding air from the connecting conduit that interconnects the first and second tees.