The present invention provides a light-receiving module that realized a reliable wire bonding from a light-receiving device to a die-capacitor on which the light-receiving device is mounted with adhesive. The connection of the incoming water is made to a central main portion of the water purifier, that the discharge of the purified water is effected from the central main portion, and that the central main portion is located between the demountable parts. The system then provides the setup information to a process measurement system for use in measuring production wafers in a semiconductor manufacturing process.