Disclosed is a novel method for forming an interconnect structure to provide electrical communication to an isolated junction on a semiconductor substrate assembly. The orthopaedic implant is configured to transmit implant identification data and implant sensor data to the wireless receiver in response to a power signal. The disclosed methods and samples can be used in screening of plurality of biological, chemical and material samples. wherein R1 and R2 are the same or different and each represents a hydrogen atom or an alkyl group having from 1 to 5 carbon atoms.