A temperature sensing apparatus disposed inside a chip includes first and second current generation circuits, first and second current-to-frequency converters, and a counting unit. This methodology is applicable to any distributed computing environment, such as a data communications network, in which it is desirable to have a central control unit assume the interface status polling operation of a temporarily inaccessible collection station. Any device receiving the signal can decode the information included in the signal and obtain a location to access the content from that information. The minimum transmission power level of the AP is determined by summing the range of the AP and the RRP. The copolymers have an elevated glass transition temperature, relative to polylactide resins.