A connecting block includes a first member having a flow header extending from a sealing surface, a planar end face oppositely directed with respect to the sealing surface, and a perimeter wall angularly oriented with respect to the sealing surface. The integrated circuit comprises a plurality of nozzle arrangements, each nozzle arrangement comprising a nozzle chamber and an ink ejection member positioned in the nozzle chamber. A fast curing adhesive is substantially simultaneously applied to the inner wall of the pipe conduit in as short a distance as possible to the moving tubing inversion point.