A process for the preparation of a printed wiring board that can prevent generation of crack and warpage is provided. The second IP address can be obtained from a group of IP addresses stored in a memory of the first server and the group of IP addresses can be associated with other servers. Gap sizes a, b, and c between first movable electrodes to third movable electrodes and respective first drive electrodes to third drive electrodes are successively larger. An advantage of the design is that it does not require customization of bottle and closure tooling, and thereby provides a simple and cost-effective means for combining solid and liquid materials in a unitary package.