Plasma processing methods of a semiconductor manufacturing apparatus which can minimize the amount of impurities adhered to the surface of a wafer, when a desired process using plasma is performed. A baseline heart rate change value is determined, wherein the baseline heart rate change value comprises a speed at which a first initial heart rate changes to a second initial heart rate. The inner surface is rotationally asymmetric to minimize intrusion on a vascular region of the second bone. In another example, a portable apparatus containing its operating system can directly boot a host device with one or more hardware profiles. Each of these steps may be performed wholly from the inside of the stomach and thus can eliminate the need for any surgical or laparoscopic intervention.