A semiconductor device including: a semiconductor substrate having an electrode; a resin layer formed to avoid at least a part of the electrode; a land provided on the resin layer; an interconnect which electrically connects the electrode with the land; and an external terminal bonded to the land. A detection unit 24 includes an infrared light emitter 28 and a depth camera 30. 03 \u03bcm or less as calculated from its specific surface area, a bulk density of 0.