The invention discloses a flip chip package using an interposer to electrically and mechanically connect the chip and the carrier. Provided is a mask fabrication database describing geometrical shapes S to be printed as part of a mask pattern on a reticle to fabricate a mask through use of a mask fabrication tooling. Selective growth of a Group III-V compound semiconductor crystal is carried out on the substrate on its side of natural oxide film detachment in accordance with the molecular beam epitaxial growing technique to thereby achieve an increase of substrate density. , perpendicular to the rig carrier andor the earth’s surface, such that the rig can be placed directly adjacent to a wellbore, and the top drive or a similar drive system can be engaged with and move along the mast while remaining above the wellbore. The method can include enlarging the sense port prior to inserting the plug therein.