A semiconductor package without substrate and method of manufacturing the same includes providing an interim substrate which has a front surface covered with a solder mask at selected locations. The sum of the depths of the trenches at least equals the height of the substrate. The amount of Pb and chalcogen in the respective precursor affords for a predetermined Pb:chalcogen element ratio to be present when the Pb precursor is mixed with the chalcogen element precursor. A combination of the spring portions extends in the one direction from the bottom plate portion having an outer dimension greater than the fixing hole in at least an upper part thereof.