An apparatus for mounting a motherboard includes a mounting boss and a boss backing. The connection structure comprises a supporting body of the pressure-sensitive component, which defines a respective passage, and a compressible element that is designed to be in contact with the fluid and is configured for compensating possible variations of volume thereof. According to a time stamping mechanism input time stamps are generated which become linked with data to be encoded, and are replaced before output by output time stamps, which are derived from the input time stamps by using a data delay constant.