A second optional poker tournament fee allows participating players a chance to receive a payout when finishing the poker tournament in one of one or more extra bubble spots. The electronic device package includes a first substrate having a first contact portion disposed thereon, a bump having a first contact surface connected to the first contact portion and a second contact surface disposed opposite to the first contact surface, and a buffer spring pad portion between the first contact portion of the first substrate and the first contact surface of the bump. In some applications, the crosslinking component may be hydrophobic, so as to be generally not compatible with aqueous environments.