A method for reflowing a solder dispersed between a plurality electrical circuit conductor pads attached to a flexible substrate and at least one electronic component using a laser is disclosed. A plurality of drawers are slidably supported on rails extending from two respective insides of the tow sidewalls. The via bar has a width substantially less than a half of a width of the lower metal line. The polymer preferably comprises ethylene vinyl acetate copolymers, nylon, polyester, polyurethane, or polyethylene. The number of detection cycles used for a paring validity check, used to see if a detected target or a pair of frequencies is an actual target or a pair for an actual target, is set in response to the relative velocity enabling the target information for a target of higher relative velocity to be output more quickly. Electricity is conducted to the cable in either a powering mode, in which a powered system is electrically coupled to the cable and substantially no inductive heating of the fluid conduit is provided, or a heating mode, in which the powered system is electrically decoupled from the cable and inductive heating of the fluid conduit is provided.