Inputoutput configurations of a computing environment are managed. The thermosetting resin composition can give a protection film for flexible printed circuits that has excellent long-term reliability of electric insulation, flexibility, and low warpage from curing shrinkage, and particularly low tackiness. In some embodiments, the spike can be retracted when the system is carried in a golf bag. 65 or less, which is particularly useful for blow molding containers for low pressure, low temperature applications. As the partial vacuum is drawn, the protrusion moves to a second shape that may be different than the first shape and that closely conforms to the selected shape of the forming tool.