Epoxy resin compositions are disclosed which comprise at least one cycloaliphatic epoxy resin, at least one anhydride curing agent, at least one a boron containing catalyst that is essentially free of halogen, at least one cure modifier, and, optionally at least one ancillary curing catalyst. A first conductive pattern structure contacting a first diffusion prevention insulation pattern and having a planarized top surface is formed in the first opening. A desired distance between the measuring probe and the object is substantially maintained by adjusting the position of the measuring probe based on the measurement signal. The ticket can identify each of the group of mobile computing devices and can include encrypted NAT hole punch data associated with each of the mobile computing devices.