A method for preparing a semiconductor wafer wherein rapid thermal annealing is conducted to smooth a free surface of a superficial zone that is supported by the wafer. An image sensor may be introduced into an environment having an image sensing module. The capacitor includes first and second electrodes and a capacitor dielectric between the first and second electrodes. The chuck actuating shaft can have a threaded aperture. When the mismatch arises, a warning is displayed on a display device of the image forming apparatus to give the warning to an operator. The invention is also for aircrafts that are equipped with at least a glazing device and a soundproofing method for glazing.