In accordance with an embodiment, a manufacturing method of a semiconductor device includes forming a polish target film on a substrate and conducting a CMP process for the polish target film. The battery or group of batteries can have three leads. Thus, the number of memory cells can be reduced to a half. When the power supply is again turned on, a main CPU allows a display section to display information indicating that the power supply is disconnected due to the drop of the device. The coded data includes a machine-readable pattern of coded data identifying a unique region identity for association with a substrate to be printed.