A lateral HEMT includes a substrate, a first semiconductor layer above the substrate and a second semiconductor layer on the first semiconductor layer. The complete semiconductor manufacturing complement of processing tools is sub-divided into short-loops or sub-modules, which are then combined into a full loop. The aerosol is pyrolyzed to form particles, which are then cooled and collected. A spring force in a direction of being relatively directed to one end portion side of the hollow rod is applied to the outer cylindrical body by a compression coil spring. The article is essentially secured in the gripping device by a combination of acceleration forces generated along a movement path of the gripping device and of the force of gravity.