A metal sheet pile has an improved joint strength and is suitable for high productivity manufacturing. The molded positioning body has a planar first main face and a plurality of receptacles for receiving the power semiconductor modules therein. A pulsed power waveform provides power to the transceivers and data through pulse width modulation of the pulsed waveform. The integrated circuit may include a selector for transmitting the oscillating output signal and for masking the charging andor discharging of the capacitive device.